Publications serve several purposes in university life ...

 

• Rather than having a "publish or perish" attitude, an academic scientist WANTS to publish work that represents the fruits of considerable labor. It's our "pay-off" for a lot of training and effort.

• We study things that have NEVER been uncovered in previous scientific investigations and a historical record of the quest and its results is important.

• We seek to teach our grad students how to "do science" at the highest level which includes peer review of your work and how to report it effectively.

• Great publications help our students get jobs that fit their talent and skill set.

​

​

​

​

• 2015 IMAPS STEVE ADAMSON AWARD (International Microelectronics Assembly and Packaging Society) for Cong Zhao for his work on Pb-free alloy reliability.

​

• 2015 BEST STUDENT PAPER, Surface Mount Technology Association (SMTA).Chaobo Shen, Cong Zhao, Zhou Hai, Jiawei Zhang, M. J. Bozack, J. C. Suhling, and J. L. Evans, “Long-Term Aging Effects on the Reliability of Lead-Free Solder Joints in Ball Grid Array Packages with Various Pitch Sizes and Ball Alignments,” Proc. SMTA International, Sept 27-Oct 1, 2015, Rosemont, IL, USA.

​

• BEST SESSION PAPER for M. Hasnine, B. Prorok, M. J. Bozack, P. Lall, and J. C. Suhling, “Exploration of Aging Induced Evolution of Solder Joints Using Nanoindentation and Microdiffraction,” 64rd IEEE Elect. Comp. and Technol. Conf. (ECTC), Orlando, FL, May 2014.

​

• RUNNER-UP, BEST CONFERENCE PAPER, E. K. Snipes, G. T. Flowers, P. Lall, and M. J. Bozack, “Absence of Striations on Sn Whiskers During Thermal Cycling,” Proc. 60th Int’l IEEE Holm Conference on Electrical Contacts, 2014.

​

• BEST PAPER OF CONFERENCE AWARD and FEATURED ARTICLE, TRIBOLOGY AND LUBRICATION TECHNOLOGY MAGAZINE for Society of Tribologists and Lubrication Engineers Annual Meeting, for Hamed Ghaednia , Hasan Babaei, R. L. Jackson, M. J. Bozack, and J. M. Khodadadi, “The Effect of Nanoparticles on Thin Film Elasto-Hydrodynamic Lubrication,” Appl. Phys. Lett. 103 (2013) 263111.

​

• 2012 SPRINGER THESIS SELECTION for Erika Crandall for her Ph.D. thesis on tin whiskering, awarded to the top 100 Ph.D. theses worldwide.

​

• BEST PAPER IN SESSION for J. Zhang, Zhou Hai, S. Thirugnanasabandam, J. L. Evans, and M. J. Bozack.Paper entitled "Isothermal Aging Effects on the Thermal Reliability Performance of Lead-Free Solder Joints" 45th International Symposium on Microelectronics (IMAPS'2012), Sept. 9-13, 2012 in San Diego, CA.

​

• 2012 OUTSTANDING DOCTORAL STUDENT AWARD for Erika Crandall, awarded by AU graduate school, April 26, 2012 (given to 10 outstanding doctoral students).

​

• 2011 YOUNG INVESTIGATOR AWARD for Erika Crandall for her paper E. R. Crandall, G. T. Flowers, P. Lall, and M. J. Bozack, “Whisker Growth Under Controlled Humidity Exposure,” Proc. 57th IEEE Holm Conference on Electrical Contacts, Minneapolis, MN, Oct 2011 (Holm’s best conference paper award).

​

• 2010 BEST CONFERENCE PAPER AWARD for Z. Cai, Y. Zhang, J. C. Suhling, P. Lall, R. W. Johnson, and M. J. Bozack, “Reduction of Lead-Free Solder Aging Effects Using Doped SAC Alloys,” Proc. 60th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, June 2-5, 2010, pp. 1493-1511.

​

• 2005 HIGHLY RECOMMENDED PAPER AWARD for “Thermal Cycling Reliability of Pb-Free Chip Resistor Solder Joints,” in Soldering and Surface Mount Technology 16/2 (2004) 77. This award is given to the top four journal articles in 2004 as chosen by an editorial team of leading researchers from Soldering and Surface Mount Technology.

 

​

 

​

​

• (INVITED PAPER) M. J. Bozack, E. K. Snipes, and G. T. Flowers, “Methods for Fast, Reliable Sn Whisker Growth” Surf. Sci. 652 (2016) 355.

​

• C. Shen, Z. Hai, C. Zhao, J. Zhang, J. L. Evans, M. J. Bozack, and J. C. Suhling, “Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board-Level Thermal Test under Long-Term Aging and Cycling,” Materials 10 (2017) 451 http://www.mdpi.com/1996-1944/10/5/451/pdf

​

• Anto Raj, Sivasubramanian Thirugnanasambandam, Thomas Sanders,Sharath Sridhar, Seth Gordon, John Evans, Fadel Megahed, M. J. Bozack, Wayne Johnson, and Mark Carpenter, “Proportional Hazard Model of Doped Low Creep Lead Free Solder Paste under Thermal Shock,” 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) pp. 1191 – 1201 10.1109/ITHERM.2016.7517683.

 

• Sivasubramanian Thirugnanasambandam, Anto Raj, Derrick Stone, Thomas Sanders, Sharath Sridhar, Seth Gordon, John Evans, Fadel Megahed, George Flowers, M. J. Bozack, Wayne Johnson, and Mark Carpenter, “Proportional Hazard Model of Doped Low Creep Lead Free Solder Paste under Vibration,” 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm, pp. 1209 - 1217, DOI: 10.1109/ITHERM.2016.7517685.

 

• R. N. Dean, F. T. Werner, and M. J. Bozack, “A Comparison of Immersion Gold and Tin Surface Finishes on Sensing Electrodes for PCB Environmental Saltwater Concentration Sensors,” 49th Intl Symposium on Microelectronics, Pasadena, CA, Oct. 10-13, 2016, pp. 557-562.

​

• S. K. Snipes, G. T. Flowers, and M. J. Bozack, “Influence of Systematic Coefficient of Thermal Expansion (CTE) Variations on Sn Whiskering,” Proc. 2016 Int’l IEEE 62th Holm Conference on Electrical Contacts, Oct. 11-14, 2016. https://doi.org/10.1109/HOLM.2016.7780033.

 

• (BEST STUDENT PAPER 2015) Surface Mount Technology Association (SMTA) International, Sept 27-Oct 1, 2015, Rosemont, IL, USA, pp. 199-206.Chaobo Shen, Cong Zhao, Zhou Hai, Jiawei Zhang, M. J. Bozack, J. C. Suhling, and J. L. Evans, “Long-Term Aging Effects on the Reliability of Lead-Free Solder Joints in Ball Grid Array Packages with Various Pitch Sizes and Ball Alignments.”

 

• Chaobo Shen, Cong Zhao, Zhou Hai, Jiawei Zhang, M. J. Bozack, J. C. Suhling, and J. L. Evans, “Sn-Ag-Cu Solder Joint Interconnection Reliability of BGA Packages during Thermal Aging and Cycling,” Int. Symposium on Microelectronics (2015) 135-140.

 

• T. Sanders, S. Thirugnanasabandam, J. Evans, M. J. Bozack, R. W. Johnson,and J. C. Suhling, “Component Level Reliability for High Temperature Power Computing with SAC305 and Alternative High Reliability Solders,”Proc. Surface Mount Technology Association (SMTA) International, Sept 27-Oct 1, 2015, Rosemont, IL, USA, pp. 144-150.

 

• Chaobo Shen, Zhou Hai, Cong Zhao, Jiawei Zhang, M. J. Bozack, John L. Evans and J. C. Suhling, “Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints during Thermal Cycling,” ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (ASME/InterPACK), Vol. 2, pp. V002T02A033 (8 pages), ISBN: 978-0-7918-5689-5; https://doi.org/10.1115/IPACK2015-48009

 

• M. Hasnine,J. C. Suhling, B. Prorok, M. J. Bozack, and P. Lall, “Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints,” ASME 2015 Intl Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco, July 6-9, 2015 (InterPack 2015) https://doi:10.1115/IPACK2015-48623 (15 pages).

 

• M. Basit, M. Motalab, J. C. Suhling, Z. Hai, J. Evans, M. J. Bozack, and P. Lall, “Thermal Cycling Reliability of Aged PBGA Assemblies—Comparison of Weibull Failure Data and Finite Element Model Predictions,” 2015 Elect.Comp. and Tech. Conf. 2015, pp. 106-117.

 

• M. Hasnine, J. C. Suhling, B. C. Prorok, M. J. Bozack, and P. Lall, “Nanomechanical Characterization of SAC Solder Joints—Reduction of Aging Effects Using Microalloy Additions,” 2015 Elect.Comp. and Tech. Conf. 2015, pp. 1574-1585.

 

• E. K. Snipes, G. T. Flowers, P. Lall, and M. J. Bozack, “Influence on Sn Whiskering of Controlled Bismuth Additions to Sputtered Sn Films,” Proc. 61th Int’l IEEE Holm Conference on Electrical Contacts, Oct. 11-14, 2015, pp. 54-58.

 

• (BEST SESSION PAPER) M. Hasnine, B. Prorok, M. J. Bozack, P. Lall, and J. C. Suhling, “Exploration of Aging Induced Evolution of Solder Joints Using Nanoindentation and Microdiffraction,” 64rd IEEE Elect. Comp. and Technol. Conf., ECTC, 2014, 379-394; http://dx.doi.org/10.1109/ECTC.2014.6897315

 

• J. Zhang, Zhou Hai, S. Thirugnanasambandam, J. L. Evans, M. J. Bozack, R. Sesek, Y. Zhang, and J. C. Suhling, “Isothermal Aging Effects on the Harsh Environment Performance of Lead-Free Solder Joints,” SMTA International Conf. 2012, Oct. 14, 2014.

 

• Z. Hai, C. Zhao, J. Zhang, J. L. Evans, and M. J. Bozack “The Effect of Isothermal Aging on the Reliability of Sn-Ag-Cu Solder Joints Using Various Surface Finishes,” Proc. Surface Mount Technology Association Int’l Conference (2014) 294-298.

 

• Md Hasnine, J. C. Suhling, B. C. Prorok, M. J. Bozack and P. Lall, “Nanomechanical Characterization of SAC305 Solder Joints—Effects of Aging,” IEEE Thermal and Thermomechanical Phenomena in Electronic Systems Conference Proceedings, ITHERM 2014, 152-160.  http://dx.doi.org/10.1109/ITHERM.2014.6892275.

​

 

​